Winbond Wpce773la0dg Datasheet Pdf Download _verified_ 2021 May 2026

The Winbond WPCE773LA0DG is a highly integrated Input/Output (I/O) controller chip, typically classified within the processors or microcontrollers category. While direct "2021" manufacturer-issued datasheet PDFs are scarce due to its legacy status, technical documentation and procurement options remain available through specialized distributors. Technical Specifications

Replacement: The WPCE773 series is often interchangeable with specific revisions, but check the suffix (e.g., LA0DG) to ensure firmware compatibility. winbond wpce773la0dg datasheet pdf download 2021

• [ ] The file name contains "WPCE773" and "Rev1.4" or higher.
• [ ] The PDF is not password-protected or watermarked "Preliminary."
• [ ] The revision history includes a 2021 entry (e.g., "Updated register 0x2F bit definitions").
• [ ] The document includes full thermal and mechanical drawings for the LQFP-128 package.

, which acquired Winbond’s Motherboard Managed IC business. ariat-tech.com Key Technical Specifications Package Type : 128-pin QFP (Quad Flat Package). Device Category : Embedded Controller (EC) / Super I/O. Operating Temperature : Specified for an extended range of negative 40 raised to the composed with power C positive 105 raised to the composed with power C Core Functionality The Winbond WPCE773LA0DG is a highly integrated Input/Output

Interfacing with input devices to ensure keystrokes and movements are registered correctly. Thermal Monitoring: [ ] The file name contains "WPCE773" and "Rev1

LPC Cycle Types (Section 8)

For firmware developers, the datasheet details memory-mapped versus I/O-mapped cycles. The 2021 version corrects a previous error in the “DMA Channel Enable” register map.

2. Component Overview

2.1 General Description

The WPCE773LA0DG is a member of the WPCE773 family. It functions as the keyboard controller and system manager. It is typically fabricated using a low-power CMOS process and is designed to interface with the main chipset (PCH or Southbridge) via the LPC (Low Pin Count) bus.

1. Errata Corrections: Winbond fixed several silicon bugs related to LPC bus timing under heavy DMA load.
2. Updated Timing Diagrams: More precise waveforms for UART baud rate generation and PWM fan control.
3. Register Map Clarifications: Additional notes on reserved registers that should not be modified.
4. Application Notes Integration: Guidelines for routing the 128-pin LQFP on 2-layer vs. 4-layer PCBs.
5. Obsolete Part Notices: The 2021 revision may indicate which Winbond parts are being phased out, helping with long-term product lifecycle planning.