The IPC-4556 standard specifically governs the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) plating for printed circuit boards. This finish is often called the "Universal Finish" because it supports multiple assembly methods, such as soldering and wire bonding, while preventing "Black Pad" issues common in older finishes.
The IPC-4556 PDF outlines the performance requirements for stencil fabrication methods, including: ipc-4556 pdf
Reduction Assisted Gold (RAIG): The updated standard now includes guidelines for newer gold plating technologies, such as hybrid or semi-autocatalytic gold, which allow for thicker gold deposits without risking nickel corrosion. The IPC-4556 standard specifically governs the use of
Lead-Free Soldering: High-strength solder joints with SAC alloys. Reduction Assisted Gold (RAIG): The updated standard now
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